ALEXANDRIA, Va., June 4 -- United States Patent no. 12,319,332, issued on June 3, was assigned to ALFRED KARCHER SE & Co. KG (Winnenden, Germany). "Cleaning system comprising at least one hand-guided... Read More
ALEXANDRIA, Va., June 4 -- United States Patent no. 12,320,058, issued on June 3, was assigned to Chongqing Haier Roller Washing Machine Co. Ltd. (Chongqing, China) and Haier Smart Home Co. Ltd. (Qing... Read More
ALEXANDRIA, Va., June 4 -- United States Patent no. 12,322,986, issued on June 3, was assigned to ChargeItSpot LLC (Philadelphia). "System and method for providing interconnected and secure mobile de... Read More
ALEXANDRIA, Va., June 4 -- United States Patent no. 12,318,154, issued on June 3, was assigned to INTUITIVE SURGICAL OPERATIONS INC. (Sunnyvale, Calif.). "Motor assembly" was invented by David W. Wei... Read More
ALEXANDRIA, Va., June 4 -- United States Patent no. 12,318,377, issued on June 3, was assigned to Seed Health Inc. (Venice, Canada). "Method and system for reducing the likelihood of a porphyromonas ... Read More
ALEXANDRIA, Va., June 4 -- United States Patent no. 12,320,842, issued on June 3, was assigned to HAMAMATSU PHOTONICS K.K. (Hamamatsu, Japan). "Inspection device for a semiconductor device" was inven... Read More
ALEXANDRIA, Va., June 4 -- United States Patent no. 12,320,009, issued on June 3. "Thermal spraying of ceramic materials" was invented by Nuria Espallargas (Trondheim, Norway) and Fahmi Mubarok (Tron... Read More
ALEXANDRIA, Va., June 4 -- United States Patent no. 12,318,248, issued on June 3, was assigned to SAMSUNG MEDISON Co. LTD. (Gangwon-do, South Korea). "Ultrasound diagnosis apparatus and diagnosis met... Read More
ALEXANDRIA, Va., June 4 -- United States Patent no. 12,322,832, issued on June 3, was assigned to LG Energy Solution Ltd. (Seoul, South Korea). "Nanoporous separators for batteries and related manufa... Read More
ALEXANDRIA, Va., June 4 -- United States Patent no. 12,322,705, issued on June 3, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Chip package and manufacturing method... Read More